GE Mark VIe IS210BPPCH1AC I/O Pack Processor Card Fieldbus Expansion Module temperature (-20 ºC to 70

temperature (-20 ºC to 70 ºC) option

ABB Type Designation: PFSK 152

100/1000 Mbps Multi-mode Fiber

Ambient Temperature: -20…+70 ºC

GE Mark VIe IS210BPPCH1AC I/O Pack Processor Card Fieldbus Expansion Module temperature (-20 ºC to 70Description The IS210BPPCH1AC is an I O Pack Processor Board designed by General Electric for use within the Mark VIe Speedtronic system, specifically for the UCPA (Universal Control Pack Assembly). This board represents an upgrade over the older BPPB input and output packs, featuring newer components and enhanced capabilities. It is important to note that while the IS210BPPCH1AC is designed for the Mark VIe system, the BPPCS1 boards should be used